Electronic heat dissipation structural components are manufactured using engineering plastics such as PC+ABS, PA66+GF, and PBT through injection molding combined with optimized heat dissipation design. They are commonly used for heat dissipation, support, and protection within electronic devices.

1. Material Preparation and Drying
2. Injection Molding of Heat Sinks or Air Guides
3. Surface Texture Treatment
4. Functional Testing (Heat Dissipation Efficiency, Assembly Accuracy)
5. Finished Product Packaging

Suitable for fan air guides, electronic cooling modules, and internal ventilation structures

Provides stable heat dissipation support

• High-precision molding ensures airflow guidance
• Excellent heat resistance
• Lightweight, reduces equipment weight
• High assembly accuracy, suitable for complex structures
• Mass production possible

Q1: Is glass fiber reinforcement supported?

A1: Yes.

Q2: Is it heat-resistant?

A2: Up to 120°C.

Q3: Is it environmentally friendly?

A3: RoHS compliant.

Q4: Is the shape customizable?

A4: OEM/ODM available.

Q5: Is it suitable for mass production?

A5: Yes, the mold life is long.

We can customize the heat dissipation structure shape, air guide design, snap-on connectors, logo, and more to meet the cooling needs of different electronic devices.